The ODB++ data format was expanded in 2020 and was designed to facilitate communication between designer and manufacturer by use of a digital twin. The XML version was developed beginning 2000, and ended in 2008 with the donation to IPC. It added the ++ suffix when component names were added in 1997. Valor was founded in 1992 and it released ODB in 1995. ODB++ covers the specification of not only conductor layer artwork and drill data, but also material stack up, netlist with test points, component bill of materials, component placement, fabrication data, and dimension data. In ODB++(X), the database is contained in a single XML file by default. For example, on Unix tar and gzip commands can be used. However, for transmission it is convenient to use common operating system commands that create a single, compressed file that preserves the hierarchy information. When in use, ODB++ data is stored in a hierarchy of files and file folders. After the bare board is manufactured, the electronic components are placed and soldered, for example by SMT placement equipment and wave or reflow soldering. Other formats are compared and contrasted below. ODB++ is one such file format for performing this transfer. Since the CAD and CAM systems are generally produced by different companies, they have to agree on a CAD-to-CAM data exchange format to transfer the data. To physically realize the design, the computerized design information must be transferred to a photolithographic computer-aided manufacturing (CAM) system. These PCBs are designed using a computer-aided design (CAD) system. Inside almost every electronic device is a PCB onto which the semiconductor and other components are mechanically and electrically connected by soldering.